Invention Grant
- Patent Title: Glass cutting apparatus, glass-substrate disassembling apparatus, glass-substrate disassembling system, glass cutting method, and glass-substrate disassembling method
- Patent Title (中): 玻璃切割装置，玻璃基板拆卸装置，玻璃基板拆卸系统，玻璃切割方法和玻璃基板拆卸方法
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Application No.: US12445606Application Date: 2007-10-05
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Publication No.: US08621738B2Publication Date: 2014-01-07
- Inventor: Hiroshi Iwamoto , Yoshiyuki Tani , Fumio Yamazaki , Takao Hisazumi
- Applicant: Hiroshi Iwamoto , Yoshiyuki Tani , Fumio Yamazaki , Takao Hisazumi
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2006-281086 20061016
- International Application: PCT/JP2007/069592 WO 20071005
- International Announcement: WO2008/047622 WO 20080424
- Main IPC: B23P11/00
- IPC: B23P11/00 ; B23P19/00
Abstract:
A glass cutting apparatus (101) includes a pair of cutters (13a, 13b) installed oppositely to each other in such a way as to sandwich, therebetween, a glass plate with surfaces of the glass plate thereof being along a vertical direction; a first pressing unit (14a) which presses one of the cutters to one of the surfaces of the glass plate in a horizontal direction with a pressing force P; a second pressing unit (14b) which is placed oppositely to the first pressing unit and presses the other one of the cutters to the other surface of the glass plate in the horizontal direction with the pressing force P; and a moving unit (20) which moves the pair of cutters pressing the glass plate with the pressing force P.
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