Invention Grant
- Patent Title: Hydroforming apparatus and method for hydroforming
- Patent Title (中): 液压成型设备和液压成型方法
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Application No.: US12737320Application Date: 2009-06-30
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Publication No.: US08621904B2Publication Date: 2014-01-07
- Inventor: Masaaki Mizumura , Koichi Sato , Manabu Wada , Yukihisa Kuriyama
- Applicant: Masaaki Mizumura , Koichi Sato , Manabu Wada , Yukihisa Kuriyama
- Applicant Address: JP Tokyo JP Tokyo
- Assignee: Nippon Steel,Sumitomo Metal Corporation
- Current Assignee: Nippon Steel,Sumitomo Metal Corporation
- Current Assignee Address: JP Tokyo JP Tokyo
- Agency: Kenyon & Kenyon LLP
- Priority: JP2008-175760 20080704
- International Application: PCT/JP2009/062246 WO 20090630
- International Announcement: WO2010/002017 WO 20100107
- Main IPC: B21D26/02
- IPC: B21D26/02 ; B21J5/04

Abstract:
A hydroforming apparatus and working method able to simply find a load path are proposed, which system and method use a mold in which contact sensors able to judge contact with a metal tube inside the mold are mounted at least at two different positions in the tube axial direction, perform a first step of axially pushing tube ends in a state with the internal pressure held at a constant value and stopping the progress of the axial pushing action when judging that among the contact sensors not yet in contact mounted at positions closest to the tube ends detect contact with the metal tube, next perform a second step of raising only the internal pressure while leaving the positions of the tube ends fixed and stopping the increase in the internal pressure when the contact sensor not yet in contact judges contact, next perform a third step of lowering the internal pressure to the value before raising it while leaving the positions of the tube ends fixed, and repeat said first step to third step until all of said contact sensors judge contact so as to obtain a hydroformed part.
Public/Granted literature
- US20110120203A1 Hydroforming apparatus and method for hydroforming Public/Granted day:2011-05-26
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