Invention Grant
- Patent Title: Cutting apparatus with adjustable mechanism
- Patent Title (中): 具有可调机构的切割装置
-
Application No.: US13010529Application Date: 2011-01-20
-
Publication No.: US08621971B2Publication Date: 2014-01-07
- Inventor: Fang Jiang , Fa-Ye Li , Peng Tan , Yang Bi , Li-Heng Cen , Yuan-Xu Zou
- Applicant: Fang Jiang , Fa-Ye Li , Peng Tan , Yang Bi , Li-Heng Cen , Yuan-Xu Zou
- Applicant Address: CN Shenzhen TW New Taipei
- Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen TW New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN201010234740 20100723
- Main IPC: B26D5/08
- IPC: B26D5/08 ; B26D1/00

Abstract:
A cutting apparatus configured for aligned with a gate of an injection molding part, includes a bottom board, a main adjustable mechanism attached to the bottom board, and a cutting mechanism. The main adjustable mechanism includes a driving device, a mounting member attached to the driving device, and a rotatable member rotatably attached to the mounting member. The rotatable member can be rotatable relative to the mounting member between a first position, where an acute angle is formed between the rotatable member and the mounting member, and a second position, where the rotatable member parallel to and abuts the mounting member.
Public/Granted literature
- US20120017740A1 CUTTING APPARATUS Public/Granted day:2012-01-26
Information query