Invention Grant
- Patent Title: Electroless plating system
- Patent Title (中): 无电镀系统
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Application No.: US13111859Application Date: 2011-05-19
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Publication No.: US08622017B2Publication Date: 2014-01-07
- Inventor: Igor Ivanov , Robert D. Tas , Shashank Ravindra Kulkarni , Ron Rulkens
- Applicant: Igor Ivanov , Robert D. Tas , Shashank Ravindra Kulkarni , Ron Rulkens
- Applicant Address: US CA Fremont
- Assignee: Lam Research Corporation
- Current Assignee: Lam Research Corporation
- Current Assignee Address: US CA Fremont
- Agency: Martine Penilla Group, LLP
- Main IPC: B05C5/02
- IPC: B05C5/02
Abstract:
An electroless plating system includes a plating solution, and controlling reducing agents in the plating solution for deposition over outlier features smaller than about five hundred nanometers and isolated by about one thousand nanometers.
Public/Granted literature
- US20110214608A1 Electroless Plating System Public/Granted day:2011-09-08
Information query
