Invention Grant
- Patent Title: Light emitting element module and manufacturing method thereof, and backlight apparatus
- Patent Title (中): 发光元件模块及其制造方法以及背光装置
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Application No.: US12832755Application Date: 2010-07-08
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Publication No.: US08622594B2Publication Date: 2014-01-07
- Inventor: Toshiya Ishio , Yasuhiko Tanaka
- Applicant: Toshiya Ishio , Yasuhiko Tanaka
- Applicant Address: JP Osaka
- Assignee: Sharp Kabushiki Kaisha
- Current Assignee: Sharp Kabushiki Kaisha
- Current Assignee Address: JP Osaka
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2009-164260 20090710
- Main IPC: F21V17/00
- IPC: F21V17/00 ; H01L33/00

Abstract:
A light emitting element module with a high yield where a portion through which a substrate and a lens are bonded can be prevented from cracking and peeling due to thermal expansion is provided. A light emitting element part equipped with a light emitting element and an optical lens for diffusing light from the light emitting element are provided on a substrate in the light emitting element module, where the lens is fixed to the substrate with an adhesive resin having a tensile breaking elongation of 50% or more. The lens also has a plurality of supports and is fixed to the substrate through these supports, so that stress in the portion where the substrate and the lens are bonded can be dispersed between the supports, and a layer in which air can circulate so as to release heat is provided between the substrate and the lens.
Public/Granted literature
- US20110007493A1 LIGHT EMITTING ELEMENT MODULE AND MANUFACTURING METHOD THEREOF, AND BACKLIGHT APPARATUS Public/Granted day:2011-01-13
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