Invention Grant
- Patent Title: Ejection mechanism and mold using the same
- Patent Title (中): 喷射机构和模具使用相同
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Application No.: US13083601Application Date: 2011-04-11
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Publication No.: US08622733B2Publication Date: 2014-01-07
- Inventor: Hsiang-Hung Chen
- Applicant: Hsiang-Hung Chen
- Applicant Address: TW New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agency: Altis Law Group, Inc.
- Priority: TW99111880A 20100415
- Main IPC: B29C45/44
- IPC: B29C45/44

Abstract:
An exemplary ejection mechanism includes a first plate and a second plate opposite to the first plate, an ejector plate, ejectors, an actuator with a driving shaft, and a drive mechanism. The ejector plate and the drive mechanism are located between the first plate and the second plate. The ejection mechanism further defines first through holes which pass through the first plate and the second plate. The ejector plate defines a second through hole which is coaxial with the first through holes. The ejector extends from the ejecting plate to the first plate and aligns with the ejector hole of the first plate. The drive mechanism links with the driving shaft and the ejector plate, and the actuator drives the ejector plate between the first plate and the second plate via a drive mechanism, which makes the ejector eject or retract.
Public/Granted literature
- US20110256259A1 EJECTION MECHANISM AND MOLD USING THE SAME Public/Granted day:2011-10-20
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