Invention Grant
US08622772B2 Terminal block and method of molding it 有权
接线端子及其成型方法

  • Patent Title: Terminal block and method of molding it
  • Patent Title (中): 接线端子及其成型方法
  • Application No.: US13404062
    Application Date: 2012-02-24
  • Publication No.: US08622772B2
    Publication Date: 2014-01-07
  • Inventor: Daisuke Akuta
  • Applicant: Daisuke Akuta
  • Applicant Address: JP
  • Assignee: Sumitomo Wiring Systems, Ltd.
  • Current Assignee: Sumitomo Wiring Systems, Ltd.
  • Current Assignee Address: JP
  • Agent Gerald E. Hespos; Michael J. Porco; Matthew T. Hespos
  • Priority: JP2011-046477 20110303
  • Main IPC: H01R9/22
  • IPC: H01R9/22
Terminal block and method of molding it
Abstract:
A terminal block (10) fastens conductors by placing the conductors one above another and fastening bolts and includes a plurality of nuts (30) on which the conductors are to be placed and partition walls (50) partitioning between adjacent nuts (30). Each partition wall (50) includes an insulation wall (24) provided in an insulation plate (20) arranged below the nuts (30) and a molded resin portion (60) covering the upper surface of the insulation wall (24) and the side surface of the insulation wall (24). Exposed portions (27A), which are exposed upper end parts of a projecting portion (27) provided on the insulation wall (24), are provided on the upper end surface of the molded resin portion (60).
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