Invention Grant
- Patent Title: Substrate sealing apparatus and method of sealing substrate using the same
- Patent Title (中): 基板密封装置及其使用方法密封基板
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Application No.: US13444740Application Date: 2012-04-11
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Publication No.: US08623167B2Publication Date: 2014-01-07
- Inventor: Dong-Sul Kim
- Applicant: Dong-Sul Kim
- Applicant Address: KR
- Assignee: Samsung Display Co., Ltd.
- Current Assignee: Samsung Display Co., Ltd.
- Current Assignee Address: KR
- Agency: Knobbe Martens Olson & Bear LLP
- Priority: KR10-2011-0063651 20110629
- Main IPC: B29C65/00
- IPC: B29C65/00 ; B29C45/00 ; B29C47/00 ; B29C43/02 ; B29C49/00 ; B29C51/00 ; B29C43/10 ; B29C55/28 ; B32B37/00 ; B29D24/00 ; B29D29/00 ; B28B21/36 ; B28B11/08 ; A01J21/00 ; A01J25/12 ; A21C3/00 ; A21C11/00 ; A23G1/20 ; A23G3/02 ; A23P1/00
Abstract:
A substrate sealing apparatus includes a chamber, at least one lower compressing member, and at least one lower compressing member. The lower compressing member includes a lower compressing surface for emitting heat, is configured to be elevated up and lowered down in a vertical direction with respect to the compressing surface, and rotates about the vertical direction. The upper compressing member includes a lower compressing surface for emitting heat, and is configured to be elevated up and lowered down in the vertical direction.
Public/Granted literature
- US20130000837A1 SUBSTRATE SEALING APPARATUS AND METHOD OF SEALING SUBSTRATE USING THE SAME Public/Granted day:2013-01-03
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