Invention Grant
- Patent Title: Method for making patterned conductive element
- Patent Title (中): 图案化导电元件的制造方法
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Application No.: US13339703Application Date: 2011-12-29
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Publication No.: US08623224B2Publication Date: 2014-01-07
- Inventor: Jia-Shyong Cheng , Po-Shan Huang , Po-Sheng Shih , Chun-Yi Hu , Chih-Han Chao , Jeah-Sheng Wu
- Applicant: Jia-Shyong Cheng , Po-Shan Huang , Po-Sheng Shih , Chun-Yi Hu , Chih-Han Chao , Jeah-Sheng Wu
- Applicant Address: TW Zhubei, Hsinchu County
- Assignee: Shih Hua Technology Ltd.
- Current Assignee: Shih Hua Technology Ltd.
- Current Assignee Address: TW Zhubei, Hsinchu County
- Agency: Altis Law Group, Inc.
- Priority: TW100120203A 20110609
- Main IPC: H01B13/00
- IPC: H01B13/00 ; B32B37/00 ; B32B38/10

Abstract:
The present disclosure relates to a method for making pattern conductive element. The method includes steps. A substrate having a surface is provide. An adhesive layer is formed on the surface of the substrate. Part of the adhesive layer is solidified to form a solidified adhesive layer and a non-solidified adhesive layer. A carbon nanotube layer is applied on the adhesive layer. The non-solidified adhesive layer is solidified so that the carbon nanotube layer on the non-solidified adhesive layer forms a fixed carbon nanotube layer and the carbon nanotube layer on the solidified adhesive layer forms a non-fixed carbon nanotube layer. The non-fixed carbon nanotube layer is removed and the fixed carbon nanotube layer is remained to form a pattern carbon nanotube layer.
Public/Granted literature
- US20120312773A1 METHOD FOR MAKING PATTERNED CONDUCTIVE ELEMENT Public/Granted day:2012-12-13
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