Invention Grant
- Patent Title: Production method of metallized ceramic substrate
- Patent Title (中): 金属化陶瓷基板的生产方法
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Application No.: US13581668Application Date: 2011-02-21
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Publication No.: US08623225B2Publication Date: 2014-01-07
- Inventor: Naoto Takahashi
- Applicant: Naoto Takahashi
- Applicant Address: JP Shunan-shi, Yamaguchi
- Assignee: Tokuyama Corporation
- Current Assignee: Tokuyama Corporation
- Current Assignee Address: JP Shunan-shi, Yamaguchi
- Agency: Ladas & Parry LLP
- Priority: JP2010-045294 20100302
- International Application: PCT/JP2011/053706 WO 20110221
- International Announcement: WO2011/108388 WO 20110909
- Main IPC: H01B13/00
- IPC: H01B13/00

Abstract:
The present invention provides a method of forming a fine pattern by the post-firing method. The production method of a metallized ceramic substrate comprises: a first step of forming an organic base layer on a ceramic substrate; a second step of forming a metal paste layer on the organic base layer to produce a metallized ceramic substrate precursor; and a third step of firing the metallized ceramic substrate precursor, wherein the organic base layer is a layer which absorbs a solvent in the metal paste layer and thermally decomposes at a temperature of firing the metal paste layer.
Public/Granted literature
- US20130001199A1 PRODUCTION METHOD OF METALLIZED CERAMIC SUBSTRATE Public/Granted day:2013-01-03
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