Invention Grant
US08623225B2 Production method of metallized ceramic substrate 有权
金属化陶瓷基板的生产方法

  • Patent Title: Production method of metallized ceramic substrate
  • Patent Title (中): 金属化陶瓷基板的生产方法
  • Application No.: US13581668
    Application Date: 2011-02-21
  • Publication No.: US08623225B2
    Publication Date: 2014-01-07
  • Inventor: Naoto Takahashi
  • Applicant: Naoto Takahashi
  • Applicant Address: JP Shunan-shi, Yamaguchi
  • Assignee: Tokuyama Corporation
  • Current Assignee: Tokuyama Corporation
  • Current Assignee Address: JP Shunan-shi, Yamaguchi
  • Agency: Ladas & Parry LLP
  • Priority: JP2010-045294 20100302
  • International Application: PCT/JP2011/053706 WO 20110221
  • International Announcement: WO2011/108388 WO 20110909
  • Main IPC: H01B13/00
  • IPC: H01B13/00
Production method of metallized ceramic substrate
Abstract:
The present invention provides a method of forming a fine pattern by the post-firing method. The production method of a metallized ceramic substrate comprises: a first step of forming an organic base layer on a ceramic substrate; a second step of forming a metal paste layer on the organic base layer to produce a metallized ceramic substrate precursor; and a third step of firing the metallized ceramic substrate precursor, wherein the organic base layer is a layer which absorbs a solvent in the metal paste layer and thermally decomposes at a temperature of firing the metal paste layer.
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