Invention Grant
- Patent Title: Low-melt poly(amic acids) and polyimides and their uses
- Patent Title (中): 低熔点聚（酰胺酸）和聚酰亚胺及其用途
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Application No.: US13033085Application Date: 2011-02-23
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Publication No.: US08623253B2Publication Date: 2014-01-07
- Inventor: Scott T. Jolley , Tracy L. Gibson , Martha K. Williams , Clyde F. Parrish , Steven L. Parks
- Applicant: Scott T. Jolley , Tracy L. Gibson , Martha K. Williams , Clyde F. Parrish , Steven L. Parks
- Applicant Address: US DC Washington
- Assignee: The United States of America as Represented by the Administrator of the National Aeronautics and Space Administration
- Current Assignee: The United States of America as Represented by the Administrator of the National Aeronautics and Space Administration
- Current Assignee Address: US DC Washington
- Agent Michelle L. Ford; Hugh McTavish
- Main IPC: B29C35/02
- IPC: B29C35/02
Abstract:
Provided are low-melt polyimides and poly(amic acids) (PAAs) for use in repair of electrical wire insulation, flat or ribbon wire harnesses, and flat surfaces comprised of high-performance polymers such as inflatables or solar panels applications. Also provided are methods and devices for repair of electrical insulation.
Public/Granted literature
- US20110212334A1 Low-Melt Poly(Amic Acids) and Polyimides and their Uses Public/Granted day:2011-09-01
Information query
