Invention Grant
- Patent Title: Hopper and reduction device using the same
- Patent Title (中): 料斗和还原装置使用相同
-
Application No.: US12781990Application Date: 2010-05-18
-
Publication No.: US08623269B2Publication Date: 2014-01-07
- Inventor: Jian-Xun Ren , Kang-Ding Yang , Qun Chen
- Applicant: Jian-Xun Ren , Kang-Ding Yang , Qun Chen
- Applicant Address: CN Beijing TW New Taipei
- Assignee: Tsinghua University,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Tsinghua University,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Beijing TW New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN200910189715 20090821
- Main IPC: C22B3/02
- IPC: C22B3/02 ; F27D99/00
Abstract:
The present disclosure relates to a hopper and a reduction device using the same. The hopper and the reduction device can be used to refining a material using thermal reduction reaction. The reduction device has a body defining cavity and a hopper, wherein the hopper is slidably disposed in the cavity.
Public/Granted literature
- US20110042867A1 HOPPER AND REDUCTION DEVICE USING THE SAME Public/Granted day:2011-02-24
Information query
