Invention Grant
- Patent Title: Wafer formulation
- Patent Title (中): 晶圆配方
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Application No.: US12078092Application Date: 2008-03-27
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Publication No.: US08623401B2Publication Date: 2014-01-07
- Inventor: Pankaj Modi
- Applicant: Pankaj Modi
- Applicant Address: CA Nepean, Ontario
- Assignee: Fenwafe Inc.
- Current Assignee: Fenwafe Inc.
- Current Assignee Address: CA Nepean, Ontario
- Main IPC: A61K9/28
- IPC: A61K9/28 ; A61K9/00 ; A61K9/70 ; A61K31/439

Abstract:
An orally administrable wafer is provided comprising at least one physiologically acceptable film forming agent. The wafer is formed by mixing the film-forming agent with an aqueous solution to form a gel and exposing the gel to a plurality of heating and cooling cycles. The wafer is rapidly dissolving and suitable for administration of pharmaceutical agents.
Public/Granted literature
- US20090246257A1 Wafer formulation Public/Granted day:2009-10-01
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