Invention Grant
- Patent Title: Sputtering target for oxide thin film and process for producing the sputtering target
- Patent Title (中): 氧化物薄膜的溅射靶和溅射靶的制造方法
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Application No.: US12996598Application Date: 2009-06-05
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Publication No.: US08623511B2Publication Date: 2014-01-07
- Inventor: Hirokazu Kawashima , Koki Yano , Futoshi Utsuno , Kazuyoshi Inoue
- Applicant: Hirokazu Kawashima , Koki Yano , Futoshi Utsuno , Kazuyoshi Inoue
- Applicant Address: JP Tokyo
- Assignee: Idemitsu Kosan Co., Ltd.
- Current Assignee: Idemitsu Kosan Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Millen, White, Zelano & Branigan, P.C.
- Priority: JP2008-149752 20080606; JP2008-149753 20080606; JP2008-155669 20080613
- International Application: PCT/JP2009/060349 WO 20090605
- International Announcement: WO2009/148154 WO 20091210
- Main IPC: B32B33/00
- IPC: B32B33/00

Abstract:
Disclosed is a sputtering target that can suppress the occurrence of anomalous discharge in the formation of an oxide semiconductor film by sputtering method and can continuously and stably form a film. Also disclosed is an oxide for a sputtering target that has a rare earth oxide C-type crystal structure and has a surface free from white spots (a poor appearance such as concaves and convexes formed on the surface of the sputtering target). Further disclosed is an oxide sintered compact that has a bixbyite structure and contains indium oxide, gallium oxide, and zinc oxide. The composition amounts (atomic %) of indium (In), gallium (Ga), and zinc (Zn) fall within a composition range satisfying the following formula: In/(In+Ga+Zn)
Public/Granted literature
- US20110168994A1 SPUTTERING TARGET FOR OXIDE THIN FILM AND PROCESS FOR PRODUCING THE SPUTTERING TARGET Public/Granted day:2011-07-14
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