Invention Grant
- Patent Title: Copper-based sliding material
- Patent Title (中): 铜基滑动材料
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Application No.: US13572915Application Date: 2012-08-13
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Publication No.: US08623517B2Publication Date: 2014-01-07
- Inventor: Ryo Sato , Takuo Imai , Kentaro Tujimoto
- Applicant: Ryo Sato , Takuo Imai , Kentaro Tujimoto
- Applicant Address: JP Nagoya
- Assignee: Daido Metal Company Ltd.
- Current Assignee: Daido Metal Company Ltd.
- Current Assignee Address: JP Nagoya
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2011-180394 20110822
- Main IPC: B32B15/04
- IPC: B32B15/04 ; B32B15/18 ; B32B15/20 ; F16J15/00 ; F16C33/02

Abstract:
In a copper-based sliding material in which a Cu alloy layer contains 5% to 30% by mass of Bi, and the balance consisting of Cu and an unavoidable impurity, Bi is dispersed as particles of a Bi phase in the Cu alloy layer, and the mass ratio of the particles having a particle size of 2 to 50 μm and a circularity of 0.1 to 0.7 is 30% or more in the entire Bi phase in the Cu alloy layer, so that the particles of the Bi phase are uniformly dispersed in the Cu alloy layer. Therefore, the particles of the Bi phase in the Cu alloy layer are sequentially exposed to a sliding surface as wear of the sliding material progresses while excessive flow-out of molten Bi is prevented, so that improved seizure resistance is achieved.
Public/Granted literature
- US20130052473A1 COPPER-BASED SLIDING MATERIAL Public/Granted day:2013-02-28
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