Invention Grant
- Patent Title: Cutting tool
- Patent Title (中): 切割用具
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Application No.: US13638574Application Date: 2011-03-28
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Publication No.: US08623525B2Publication Date: 2014-01-07
- Inventor: Masahiro Waki , Mitsuru Hasegawa
- Applicant: Masahiro Waki , Mitsuru Hasegawa
- Applicant Address: JP Kyoto
- Assignee: Kyocera Corporation
- Current Assignee: Kyocera Corporation
- Current Assignee Address: JP Kyoto
- Agency: Schlee IP International, P.C.
- Agent Alexander R. Schlee
- Priority: JP2010-074581 20100329
- International Application: PCT/JP2011/057627 WO 20110328
- International Announcement: WO2011/122553 WO 20111006
- Main IPC: B32B9/00
- IPC: B32B9/00

Abstract:
A cutting tool having a high oxidation resistance, a high wear resistance and a good defect resistance. The cutting tool comprises a base body and a coating layer, the coating layer comprising TiaAlbMd(C1-xNx), M being selected as at least one member selected from among Si, W, Nb, Mo, Ta, Hf, Cr, Zr and Y; and a, b, d and x satisfy the following requirements: 0.35≦a≦0.55, 0.3≦b≦0.6, 0≦d≦0.25, a+b+d=1 and 0≦x≦1. The Al content of a droplet on the coating layer of a cutting face is higher than the Al content of the composition of the coating layer, and the Ti content of a droplet on a flank face is higher than the Ti content of the composition of the coating layer.
Public/Granted literature
- US20130022420A1 CUTTING TOOL Public/Granted day:2013-01-24
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