Invention Grant
- Patent Title: Solid state image pickup device and method of producing solid state image pickup device
- Patent Title (中): 固体摄像装置及固体摄像装置的制造方法
-
Application No.: US13711215Application Date: 2012-12-11
-
Publication No.: US08623691B2Publication Date: 2014-01-07
- Inventor: Takashi Abe , Nobuo Nakamura , Keiji Mabuchi , Tomoyuki Umeda , Hiroaki Fujita , Eiichi Funatsu , Hiroki Sato
- Applicant: Sony Corporation
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Rader, Fishman & Grauer PLLC
- Priority: JP2002-076081 20020319
- Main IPC: H01L29/00
- IPC: H01L29/00

Abstract:
Forming a back-illuminated type CMOS image sensor, includes process for formation of a registration mark on the wiring side of a silicon substrate during formation of an active region or a gate electrode. A silicide film using an active region may also be used for the registration mark. Thereafter, the registration mark is read from the back-side by use of red light or near infrared rays, and registration of the stepper is accomplished. It is also possible to form a registration mark in a silicon oxide film on the back-side (illuminated side) in registry with the registration mark on the wiring side, and to achieve the desired registration by use of the registration mark thus formed.
Public/Granted literature
- US20130171760A1 SOLID STATE IMAGE PICKUP DEVICE AND METHOD OF PRODUCING SOLID STATE IMAGE PICKUP DEVICE Public/Granted day:2013-07-04
Information query
IPC分类: