Invention Grant
- Patent Title: Semiconductor device, semiconductor device storage method, semiconductor device manufacturing method, and semiconductor manufacturing apparatus
- Patent Title (中): 半导体器件，半导体器件存储方法，半导体器件制造方法和半导体制造设备
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Application No.: US13110409Application Date: 2011-05-18
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Publication No.: US08623701B2Publication Date: 2014-01-07
- Inventor: Hisanori Nagano
- Applicant: Hisanori Nagano
- Applicant Address: JP Kanagawa
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Kanagawa
- Agency: Young & Thompson
- Priority: JP2010-136045 20100615
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A semiconductor package has a semiconductor chip, a lead frame in which a semiconductor chip is mounted on a die pad, and a resin sealing the semiconductor chip and the die pad from an upper surface and a lower surface, the resin has a concave portion disposed at the surface and a concave portion situated inside the concave portion in a plan view.
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Information query
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