Invention Grant
- Patent Title: Method of fabricating a semiconductor package with integrated substrate thermal slug
- Patent Title (中): 制造具有集成基板热芯片的半导体封装的方法
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Application No.: US13850715Application Date: 2013-03-26
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Publication No.: US08623707B2Publication Date: 2014-01-07
- Inventor: Andrew V. Kearney , Peng Su
- Applicant: Cisco Technology, Inc.
- Applicant Address: US CA San Jose
- Assignee: Cisco Technology, Inc.
- Current Assignee: Cisco Technology, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Brinks Gilson & Lione
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/10
Abstract:
To reduce the thermal stresses that may be caused by a difference in thermal expansion coefficients between a molded casing and an active side of a semiconductor device embedded in the molded casing, and thus reduce the number of corresponding failures caused by the thermal stresses, the active side of the semiconductor device is arranged face-down, towards a substrate supporting the semiconductor device. The semiconductor device includes a through via that electrically connects the active side of the semiconductor device to a passive side of the semiconductor device. A wire bond electrically connects the passive side of the semiconductor device to the substrate. To increase the dissipation of heat generated in the semiconductor device, a thermally conductive slug may be disposed in the substrate, and the active side of the semiconductor device may be attached to the thermally conductive slug.
Public/Granted literature
- US20130210196A1 SEMICONDUCTOR PACKAGE WITH INTEGRATED SUBSTRATE THERMAL SLUG Public/Granted day:2013-08-15
Information query
IPC分类:
