Invention Grant
US08623729B2 Methods of fabricating semiconductor devices with silicon-germanium channels including hydrogen
有权
制造具有包括氢的硅 - 锗通道的半导体器件的方法
- Patent Title: Methods of fabricating semiconductor devices with silicon-germanium channels including hydrogen
- Patent Title (中): 制造具有包括氢的硅 - 锗通道的半导体器件的方法
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Application No.: US13422627Application Date: 2012-03-16
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Publication No.: US08623729B2Publication Date: 2014-01-07
- Inventor: Yongkuk Jeong , Hyun-Kwan Yu , Kieun Kim
- Applicant: Yongkuk Jeong , Hyun-Kwan Yu , Kieun Kim
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Myers Bigel Sibley & Sajovec, P.A.
- Priority: KR10-2011-0024428 20110318
- Main IPC: H01L21/335
- IPC: H01L21/335

Abstract:
A semiconductor device is fabricated by providing a substrate including a silicon channel layer and a silicon-germanium channel layer, forming gate structures disposed on the silicon channel layer and on the silicon-germanium channel layer, forming a first protection layer to cover the resultant structure including the gate structures, and injecting hydrogen and/or its isotopes into the silicon-germanium channel layer. The silicon and silicon-germanium channel layers may be oriented along a direction. Related devices are also described.
Public/Granted literature
- US20120238066A1 METHODS OF FABRICATING SEMICONDUCTOR DEVICES WITH SILICON-GERMANIUM CHANNELS INCLUDING HYDROGEN Public/Granted day:2012-09-20
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