Invention Grant
- Patent Title: Epoxy resin composition, curing agent, and curing accelerator
- Patent Title (中): 环氧树脂组合物，固化剂和固化促进剂
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Application No.: US13138568Application Date: 2010-03-09
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Publication No.: US08623942B2Publication Date: 2014-01-07
- Inventor: Masami Kaneko , Kazuo Ono , Natsuki Amanokura , Naoyuki Kamegaya
- Applicant: Masami Kaneko , Kazuo Ono , Natsuki Amanokura , Naoyuki Kamegaya
- Applicant Address: JP Tokyo
- Assignee: Nippon Soda Co., Ltd.
- Current Assignee: Nippon Soda Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Foley & Lardner LLP
- Priority: JP2009-058265 20090311; JP2009-068405 20090319; JP2009-068416 20090319; JP2009-068786 20090319
- International Application: PCT/JP2010/001663 WO 20100309
- International Announcement: WO2010/103809 WO 20100916
- Main IPC: C08L63/00
- IPC: C08L63/00 ; C07D213/02 ; C07D233/54 ; C08G59/40 ; C08G59/68
Abstract:
The present invention provides a liquid curable epoxy resin composition that has excellent storage stability and curing properties and provides a cured product having excellent properties, particularly, excellent organic solvent resistance. For that purpose, a clathrate containing a carboxylic acid compound and at least one selected from the group consisting of an imidazole compound represented by formula (I), wherein R1 to R4 each represent a hydrogen atom or the like, and 1,8-diazabicyclo[5.4.0]undecene-7 (DBU) is mixed in an epoxy resin. The liquid curable epoxy resin composition uses a liquid epoxy resin or an organic solvent.
Public/Granted literature
- US20120004349A1 Epoxy resin composition, curing agent, and curing accelerator Public/Granted day:2012-01-05
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