Invention Grant
US08623968B2 Polyimide precursor composition, method for preparing polyimide, polyimide prepared by using the method, and film including the polyimide
有权
聚酰亚胺前体组合物，制备聚酰亚胺的方法，使用该方法制备的聚酰亚胺和包含聚酰亚胺的薄膜
- Patent Title: Polyimide precursor composition, method for preparing polyimide, polyimide prepared by using the method, and film including the polyimide
- Patent Title (中): 聚酰亚胺前体组合物，制备聚酰亚胺的方法，使用该方法制备的聚酰亚胺和包含聚酰亚胺的薄膜
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Application No.: US13226736Application Date: 2011-09-07
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Publication No.: US08623968B2Publication Date: 2014-01-07
- Inventor: Eun Seog Cho , Byung Hee Sohn , Young Suk Jung , Yoo Seong Yang , Sang Mo Kim
- Applicant: Eun Seog Cho , Byung Hee Sohn , Young Suk Jung , Yoo Seong Yang , Sang Mo Kim
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Cantor Colburn LLP
- Priority: KR10-2010-0130905 20101220
- Main IPC: C08F283/04
- IPC: C08F283/04 ; C08G69/48 ; C08G69/08 ; C08G18/00
Abstract:
A polyimide precursor composition includes a polyamic acid including a repeating unit represented by Chemical Formula 1 and diisocyanate represented by Chemical Formula 2. OCN-A2-NCO Chemical Formula 2 The diisocyanate represented by Chemical Formula 2 is included in an amount of about 0.01 moles to about 10 moles based on 100 moles of the repeating unit represented by Chemical Formula 1 in the polyamic acid.
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