Invention Grant
- Patent Title: Wire harness
- Patent Title (中): 线束
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Application No.: US13303213Application Date: 2011-11-23
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Publication No.: US08624115B2Publication Date: 2014-01-07
- Inventor: Miyoshi Mabuchi
- Applicant: Miyoshi Mabuchi
- Applicant Address: JP Tokyo
- Assignee: Yazaki Corporation
- Current Assignee: Yazaki Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2010-261257 20101124
- Main IPC: H01B7/00
- IPC: H01B7/00
Abstract:
A wire harness is provided. A bent portion is formed into a bent shape corresponding to a bent shape of a wire harness arrangement path on a vehicle body panel. An insulating coating of a plurality of wires constituting the bent portion or at least one of the wires has such a flexural rigidity that the bent portion has a rigidity for maintaining the bent shape thereof.
Public/Granted literature
- US20120125683A1 WIRE HARNESS Public/Granted day:2012-05-24
Information query
