Invention Grant
- Patent Title: Circuit board structure having measures against heat
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Application No.: US12735193Application Date: 2008-12-12
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Publication No.: US08624122B2Publication Date: 2014-01-07
- Inventor: Hiroki Shiraiwa , Kazuomi Kiyosue , Akinori Nakashima , Tomohiro Sugiura , Noriyoshi Yamazaki , Minoru Umezaki
- Applicant: Hiroki Shiraiwa , Kazuomi Kiyosue , Akinori Nakashima , Tomohiro Sugiura , Noriyoshi Yamazaki , Minoru Umezaki
- Applicant Address: JP Tokyo
- Assignee: Yazaki Corporation
- Current Assignee: Yazaki Corporation
- Current Assignee Address: JP Tokyo
- Agency: Edwards Wildman Palmer LLP
- Agent James E. Armstrong, IV; Stephen D. LeBarron
- Priority: JP2007-329993 20071221
- International Application: PCT/JP2008/072660 WO 20081212
- International Announcement: WO2009/081769 WO 20090702
- Main IPC: H05K1/00
- IPC: H05K1/00

Abstract:
To achieve efficient heat spreading and heat releasing by using a metal core of a circuit board, a terminal block includes an insulating block body and terminals. At least one of the terminals is provided with terminal portions for a connection with a circuit board. The terminal portions are inserted into respective through holes of the circuit board, the circuit board having a pattern circuit at a surface layer thereof and a conductive metal core at an intermediate portion in a thickness direction, so that heat of the metal core or of both the metal core and the pattern circuit is absorbed and transferred to the terminals. A bus-bar block includes an insulating block body and several parallel bus-bars with different lengths. Terminal portions at a tip end of the bus-bars are inserted, near heat-generating component on the circuit board, into the through holes of the circuit board.
Public/Granted literature
- US20100263915A1 CIRCUIT BOARD STRUCTURE HAVING MEASURES AGAINST HEAT Public/Granted day:2010-10-21
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