Invention Grant
- Patent Title: Printed circuit board
- Patent Title (中): 印刷电路板
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Application No.: US13102323Application Date: 2011-05-06
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Publication No.: US08624123B2Publication Date: 2014-01-07
- Inventor: Cheol Ho Heo , Young Ki Lee , Sang Hyun Shin
- Applicant: Cheol Ho Heo , Young Ki Lee , Sang Hyun Shin
- Applicant Address: KR Gyunggi-Do
- Assignee: Samsung Electro-Mechanics Co., Ltd
- Current Assignee: Samsung Electro-Mechanics Co., Ltd
- Current Assignee Address: KR Gyunggi-Do
- Agency: Ladas & Parry, LLP
- Priority: KR10-2011-0011197 20110208
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K7/20
Abstract:
The present invention relates to a printed circuit board. A heat radiation coating material is applied to a portion of a circuit layer formed on an outermost portion of the printed circuit board, thereby making it possible to improve heat radiation performance of the printed circuit board. The heat radiation coating material also serves as a solder resist, thereby making it possible to insulate and protect the printed circuit board without a separate solder resist.
Public/Granted literature
- US20120199381A1 PRINTED CIRCUIT BOARD Public/Granted day:2012-08-09
Information query
