Invention Grant
US08624125B2 Metal foil laminated polyimide resin substrate 有权
金属箔叠层聚酰亚胺树脂基板

Metal foil laminated polyimide resin substrate
Abstract:
The present invention relates to a metal foil laminated polyimide resin substrate wherein a metal foil is directly laminated on one side or both sides of a polyimide resin substrate; and the surface of the metal foil to be bonded to the polyimide resin substrate has a surface roughness (Rzjis) of 3.0 μm or less; a surface area ratio (B) of 1.25 to 2.50, in which the surface area ratio (B) is calculated as a ratio [A/6550] of a surface area of a two-dimensional region with a surface area of 6550 μm2 which is determined by a laser method (three-dimensional area: A μm2) to the area of the two-dimensional region; and a chromium content per unit area of the two-dimensional region of 2.0 mg/m2 or more.
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