Invention Grant
- Patent Title: Metal foil laminated polyimide resin substrate
- Patent Title (中): 金属箔叠层聚酰亚胺树脂基板
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Application No.: US12739640Application Date: 2008-10-24
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Publication No.: US08624125B2Publication Date: 2014-01-07
- Inventor: Hiroto Shimokawa , Atsushi Okabe
- Applicant: Hiroto Shimokawa , Atsushi Okabe
- Applicant Address: JP Ube-shi
- Assignee: Ube Industries, Ltd.
- Current Assignee: Ube Industries, Ltd.
- Current Assignee Address: JP Ube-shi
- Agency: Knobbe Martens Olson & Bear LLP
- Priority: JP2007-276715 20071024
- International Application: PCT/JP2008/069364 WO 20081024
- International Announcement: WO2009/054505 WO 20090430
- Main IPC: H05K1/03
- IPC: H05K1/03 ; H05K1/09

Abstract:
The present invention relates to a metal foil laminated polyimide resin substrate wherein a metal foil is directly laminated on one side or both sides of a polyimide resin substrate; and the surface of the metal foil to be bonded to the polyimide resin substrate has a surface roughness (Rzjis) of 3.0 μm or less; a surface area ratio (B) of 1.25 to 2.50, in which the surface area ratio (B) is calculated as a ratio [A/6550] of a surface area of a two-dimensional region with a surface area of 6550 μm2 which is determined by a laser method (three-dimensional area: A μm2) to the area of the two-dimensional region; and a chromium content per unit area of the two-dimensional region of 2.0 mg/m2 or more.
Public/Granted literature
- US20110005812A1 METAL FOIL LAMINATED POLYIMIDE RESIN SUBSTRATE Public/Granted day:2011-01-13
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