Invention Grant
US08624129B2 Method of attaching a high power surface mount transistor to a printed circuit board
失效
将高功率表面贴装晶体管连接到印刷电路板的方法
- Patent Title: Method of attaching a high power surface mount transistor to a printed circuit board
- Patent Title (中): 将高功率表面贴装晶体管连接到印刷电路板的方法
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Application No.: US11330774Application Date: 2006-01-12
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Publication No.: US08624129B2Publication Date: 2014-01-07
- Inventor: Robert W. Monroe
- Applicant: Robert W. Monroe
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Main IPC: H05K1/16
- IPC: H05K1/16

Abstract:
A power device that includes a printed circuit board having one or more dielectric and copper layers between a top and a bottom metal layer. The power device includes an area extending through all metal and dielectric layers of the printed circuit board except the bottom metal layer. A semiconductor device is positioned within the area and mounted to the bottom metal layer of the printed circuit board.
Public/Granted literature
- US20070158102A1 Method of attaching a high power surface mount transistor to a printed circuit board Public/Granted day:2007-07-12
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