Invention Grant
US08624129B2 Method of attaching a high power surface mount transistor to a printed circuit board 失效
将高功率表面贴装晶体管连接到印刷电路板的方法

Method of attaching a high power surface mount transistor to a printed circuit board
Abstract:
A power device that includes a printed circuit board having one or more dielectric and copper layers between a top and a bottom metal layer. The power device includes an area extending through all metal and dielectric layers of the printed circuit board except the bottom metal layer. A semiconductor device is positioned within the area and mounted to the bottom metal layer of the printed circuit board.
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