Invention Grant
US08624130B2 Circuit board having grown metal layer in a flexible zone 有权
电路板在柔性区域中生长了金属层

  • Patent Title: Circuit board having grown metal layer in a flexible zone
  • Patent Title (中): 电路板在柔性区域中生长了金属层
  • Application No.: US13140091
    Application Date: 2009-11-30
  • Publication No.: US08624130B2
    Publication Date: 2014-01-07
  • Inventor: Detlev Bagung
  • Applicant: Detlev Bagung
  • Applicant Address: DE Hannover
  • Assignee: Continental Automotive GmbH
  • Current Assignee: Continental Automotive GmbH
  • Current Assignee Address: DE Hannover
  • Agent Laurence A. Greenberg; Werner H. Stemer; Ralph E. Locher
  • Priority: DE102008062516 20081216
  • International Application: PCT/EP2009/066054 WO 20091130
  • International Announcement: WO2010/072516 WO 20100701
  • Main IPC: H05K1/11
  • IPC: H05K1/11 H05K1/02
Circuit board having grown metal layer in a flexible zone
Abstract:
A circuit board has a grown metal layer in a flexible zone. A circuit board has a first part, a second part and a recess in the circuit board that is arranged between the first part and the second part. A thickness of the circuit board reduced in the region of the recess. The first part can be pivoted relative to the second part as a result of the recess. The flexibility of the circuit board is improved in the range of the recess by a metal layer applied on a surface section of the circuit board in the recess by deposition. Furthermore, EMC problems can be reduced by the metal layer on a side wall of the recess and electrical contacts to conductor path metallization layers can be created.
Public/Granted literature
Information query
Patent Agency Ranking
0/0