Invention Grant
- Patent Title: Circuit board having grown metal layer in a flexible zone
- Patent Title (中): 电路板在柔性区域中生长了金属层
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Application No.: US13140091Application Date: 2009-11-30
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Publication No.: US08624130B2Publication Date: 2014-01-07
- Inventor: Detlev Bagung
- Applicant: Detlev Bagung
- Applicant Address: DE Hannover
- Assignee: Continental Automotive GmbH
- Current Assignee: Continental Automotive GmbH
- Current Assignee Address: DE Hannover
- Agent Laurence A. Greenberg; Werner H. Stemer; Ralph E. Locher
- Priority: DE102008062516 20081216
- International Application: PCT/EP2009/066054 WO 20091130
- International Announcement: WO2010/072516 WO 20100701
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K1/02

Abstract:
A circuit board has a grown metal layer in a flexible zone. A circuit board has a first part, a second part and a recess in the circuit board that is arranged between the first part and the second part. A thickness of the circuit board reduced in the region of the recess. The first part can be pivoted relative to the second part as a result of the recess. The flexibility of the circuit board is improved in the range of the recess by a metal layer applied on a surface section of the circuit board in the recess by deposition. Furthermore, EMC problems can be reduced by the metal layer on a side wall of the recess and electrical contacts to conductor path metallization layers can be created.
Public/Granted literature
- US20110284275A1 CIRCUIT BOARD HAVING GROWN METAL LAYER IN A FLEXIBLE ZONE Public/Granted day:2011-11-24
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