Invention Grant
US08624134B2 Package of environmental sensitive element and encapsulation method of the same 有权
环保敏感元件包装和封装方法相同

Package of environmental sensitive element and encapsulation method of the same
Abstract:
An encapsulation method of an environmental sensitive element is provided. An environmental sensitive element and a first rib are formed on a first substrate. The first rib surrounds the environmentally sensitive element. A getter layer is formed on the environmental sensitive element. A first encapsulation layer is formed to encapsulate the getter layer and the first rib. The first barrier layer is formed to encapsulate the first encapsulation layer located on the first rib. The first rib, a portion of the first encapsulation layer located on the first rib and the first barrier layer form a barrier structure. A second substrate is provided on the first substrate and a filling layer is formed between the first substrate and the second substrate. The second substrate is bonded to the first substrate by the filling layer. The filling layer encapsulates the environmental sensitive element, the first encapsulation layer and the barrier structure.
Information query
Patent Agency Ranking
0/0