Invention Grant
- Patent Title: Laser drilling methods of shallow-angled holes
- Patent Title (中): 浅角孔的激光钻孔方法
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Application No.: US13185986Application Date: 2011-07-19
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Publication No.: US08624151B2Publication Date: 2014-01-07
- Inventor: Amr Elfizy , Ghislain Hardy , Sylvain Cournoyer
- Applicant: Amr Elfizy , Ghislain Hardy , Sylvain Cournoyer
- Applicant Address: CA Longueil, Quebec
- Assignee: Pratt & Whitney Canada Corp.
- Current Assignee: Pratt & Whitney Canada Corp.
- Current Assignee Address: CA Longueil, Quebec
- Agency: Norton Rose Fulbright Canada LLP
- Main IPC: B23K26/38
- IPC: B23K26/38 ; B23K26/40 ; F02C7/00 ; F01D25/00

Abstract:
A method for drilling a shallow-angled hole through a thermal barrier coated component, in accordance with one aspect thereof, includes a step of applying a pulse laser beam with a first setting to drill a section of the hole substantially within a thermal barrier coating of the component. A further step is conducted to apply the pulse laser beam with a second setting through the initiated hole to further drill through a remainder of the component to complete the formation of the hole extending through the component.
Public/Granted literature
- US20130020294A1 LASER DRILLING METHODS OF SHALLOW-ANGLED HOLES Public/Granted day:2013-01-24
Information query
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