Invention Grant
- Patent Title: Negative coefficient thermal expansion engineered particles for composite fabrication
- Patent Title (中): 用于复合制造的负系数热膨胀工程颗粒
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Application No.: US13356778Application Date: 2012-01-24
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Publication No.: US08624152B2Publication Date: 2014-01-07
- Inventor: Gareth G. Hougham , Vijayeshwar D. Khanna , Xiao Hu Liu , Gerard McVicker
- Applicant: Gareth G. Hougham , Vijayeshwar D. Khanna , Xiao Hu Liu , Gerard McVicker
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent Daniel P. Morris, Esq.
- Main IPC: B23K26/00
- IPC: B23K26/00 ; B23B3/00 ; H01L21/30
Abstract:
Methods for the fabrication of negative coefficient thermal expansion engineered elements, and particularly, wherein such elements provide for fillers possessing a low or even potentially zero coefficient thermal expansion and which are employable as fillers for polymers possessing high coefficients of thermal expansion. Further, disclosed are novel structures, which are obtained by the inventive methods.
Public/Granted literature
- US20120121906A1 NEGATIVE COEFFICIENT THERMAL EXPANSION ENGINEERED PARTICLES FOR COMPOSITE FABRICATION Public/Granted day:2012-05-17
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