Invention Grant
- Patent Title: Semiconductor device and method of manufacturing same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US13731592Application Date: 2012-12-31
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Publication No.: US08624235B2Publication Date: 2014-01-07
- Inventor: Shunpei Yamazaki , Satoshi Seo , Hideaki Kuwabara
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP
- Agency: Husch Blackwell LLP
- Priority: JP2002-123188 20020424
- Main IPC: H01L35/24
- IPC: H01L35/24

Abstract:
A FET is formed on a semiconductor substrate, a curved surface having a radius of curvature is formed on an upper end of an insulation, a portion of a first electrode is exposed corresponding to the curved surface to form an inclined surface, and a region defining a luminescent region is subjected to etching to expose the first electrode. Luminescence emitted from an organic chemical compound layer is reflected by the inclined surface of the first electrode to increase a total quantity of luminescence taken out in a certain direction.
Public/Granted literature
- US20130119389A1 Semiconductor Device and Method of Manufacturing Same Public/Granted day:2013-05-16
Information query
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