Invention Grant
- Patent Title: Semiconductor chip, stack-type semiconductor package
- Patent Title (中): 半导体芯片，堆叠型半导体封装
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Application No.: US13307197Application Date: 2011-11-30
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Publication No.: US08624241B2Publication Date: 2014-01-07
- Inventor: Tac Keun Oh
- Applicant: Tac Keun Oh
- Applicant Address: KR Gyeonggi-do
- Assignee: SK Hynix Inc.
- Current Assignee: SK Hynix Inc.
- Current Assignee Address: KR Gyeonggi-do
- Agency: William Park & Associates Patent Ltd.
- Priority: KR10-2010-0121243 20101201; KR10-2011-0123016 20111123
- Main IPC: H01L23/58
- IPC: H01L23/58
Abstract:
A semiconductor chip includes: a first substrate having a first surface and a second surface facing away from the first surface; a first test through silicon via (TSV) passing through the first substrate from the first surface to the second surface; and a conductive protrusion coupled to the first test TSV and protruding from the second surface.
Public/Granted literature
- US20120138925A1 SEMICONDUCTOR CHIP, STACK-TYPE SEMICONDUCTOR PACKAGE, AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2012-06-07
Information query
IPC分类:
