Invention Grant
- Patent Title: Silicon carbide substrate, semiconductor device, method of manufacturing silicon carbide substrate and method of manufacturing semiconductor device
- Patent Title (中): 碳化硅衬底,半导体器件,制造碳化硅衬底的方法和制造半导体器件的方法
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Application No.: US13334855Application Date: 2011-12-22
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Publication No.: US08624266B2Publication Date: 2014-01-07
- Inventor: Shin Harada , Tsubasa Honke
- Applicant: Shin Harada , Tsubasa Honke
- Applicant Address: JP Osaka-shi, Osaka
- Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee Address: JP Osaka-shi, Osaka
- Agency: Drinker Biddle & Reath LLP
- Priority: JP2010-289593 20101227
- Main IPC: H01L29/24
- IPC: H01L29/24 ; C30B23/04

Abstract:
A main surface of a silicon carbide substrate is inclined by an off angle in an off direction from {0001} plane of a hexagonal crystal. The main surface has such a characteristic that, among emitting regions emitting photoluminescent light having a wavelength exceeding 650 nm of the main surface caused by excitation light having higher energy than band-gap of the hexagonal silicon carbide, the number of those having a dimension of at most 15 μm in a direction perpendicular to the off direction and a dimension in a direction parallel to the off direction not larger than a value obtained by dividing penetration length of the excitation light in the hexagonal silicon carbide by a tangent of the off angle is at most 1×104 per 1 cm2. Accordingly, reverse leakage current can be reduced.
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