Invention Grant
- Patent Title: Light emitting device package and method of manufacturing the same
- Patent Title (中): 发光器件封装及其制造方法
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Application No.: US12668996Application Date: 2008-07-23
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Publication No.: US08624268B2Publication Date: 2014-01-07
- Inventor: Bum Chul Cho , Jin Soo Park
- Applicant: Bum Chul Cho , Jin Soo Park
- Applicant Address: KR Seoul
- Assignee: LG Innotek Co., Ltd.
- Current Assignee: LG Innotek Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: Birch, Stewart, Kolasch & Birch, LLLP
- Priority: KR10-2007-0074399 20070725
- International Application: PCT/KR2008/004308 WO 20080723
- International Announcement: WO2009/014376 WO 20090129
- Main IPC: H01L33/48
- IPC: H01L33/48 ; H01L21/50
Abstract:
A light emitting device package is provided. The light emitting device package comprises a substrate comprising a plurality of protrusions, an insulating layer on the substrate, a metal layer on the insulating layer, and a light emitting device on the substrate electrically connected to the metal layer.
Public/Granted literature
- US20100224903A1 LIGHT EMITTING DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2010-09-09
Information query
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