Invention Grant
US08624333B2 Semiconductor device, method of forming semiconductor device, and data processing system
有权
半导体器件，半导体器件的形成方法以及数据处理系统
- Patent Title: Semiconductor device, method of forming semiconductor device, and data processing system
- Patent Title (中): 半导体器件，半导体器件的形成方法以及数据处理系统
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Application No.: US13105437Application Date: 2011-05-11
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Publication No.: US08624333B2Publication Date: 2014-01-07
- Inventor: Nan Wu
- Applicant: Nan Wu
- Agency: Young & Thompson
- Priority: JP2010-115538 20100519
- Main IPC: H01L27/088
- IPC: H01L27/088
Abstract:
A semiconductor device includes a semiconductor substrate including a fin. The fin includes first and second fin portions. The first fin portion extends substantially in a horizontal direction to a surface of the semiconductor substrate. The second fin portion extends substantially in a vertical direction to the surface of the semiconductor substrate. The fin has a channel region.
Public/Granted literature
- US20110284969A1 SEMICONDUCTOR DEVICE, METHOD OF FORMING SEMICONDUCTOR DEVICE, AND DATA PROCESSING SYSTEM Public/Granted day:2011-11-24
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