Invention Grant
- Patent Title: Electronic module metalization system, apparatus, and methods of forming same
- Patent Title (中): 电子模块金属化系统，装置及其形成方法
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Application No.: US13247913Application Date: 2011-09-28
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Publication No.: US08624335B2Publication Date: 2014-01-07
- Inventor: Jaroslaw Adamski
- Applicant: Jaroslaw Adamski
- Applicant Address: US CA San Diego
- Assignee: Peregrine Semiconductor Corporation
- Current Assignee: Peregrine Semiconductor Corporation
- Current Assignee Address: US CA San Diego
- Agency: Jaquez & Associates
- Agent Martin J. Jaquez, Esq.; Merle Richman, Esq.
- Main IPC: H01L27/088
- IPC: H01L27/088
Abstract:
Embodiments of electronic module metallization systems and apparatus and methods for forming same are described generally herein. Other embodiments may be described and claimed.
Public/Granted literature
- US20120273849A1 Electronic Module Metalization System, Apparatus, and Methods of Forming Same Public/Granted day:2012-11-01
Information query
IPC分类:
