Invention Grant
- Patent Title: Plasma processing apparatus and method thereof
- Patent Title (中): 等离子体处理装置及其方法
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Application No.: US13215276Application Date: 2011-08-23
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Publication No.: US08624340B2Publication Date: 2014-01-07
- Inventor: Tomohiro Okumura , Ichiro Nakayama , Hiroshi Kawaura , Tetsuya Yukimoto
- Applicant: Tomohiro Okumura , Ichiro Nakayama , Hiroshi Kawaura , Tetsuya Yukimoto
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2010-196388 20100902; JP2011-035664 20110222
- Main IPC: H01L27/14
- IPC: H01L27/14 ; H01L21/44

Abstract:
In a plasma torch unit, copper rods forming a coil as a whole are disposed inside copper rod inserting holes formed in a quartz block so that the quartz block is cooled by water flowing inside the copper rod inserting holes and cooling water pipes. A plasma ejection port is formed on the lowermost portion of the torch unit. While a gas is being supplied into a space inside an elongated chamber, high-frequency power is supplied to the copper rods to generate plasma in the space inside the elongated chamber so that the plasma is applied to a substrate.
Public/Granted literature
- US20120058649A1 PLASMA PROCESSING APPARATUS AND METHOD THEREOF Public/Granted day:2012-03-08
Information query
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