Invention Grant
- Patent Title: Integrated circuit packaging system with an interposer and method of manufacture thereof
- Patent Title (中): 具有插入件的集成电路封装系统及其制造方法
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Application No.: US12408670Application Date: 2009-03-20
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Publication No.: US08624370B2Publication Date: 2014-01-07
- Inventor: HeeJo Chi , NamJu Cho , Taewoo Lee
- Applicant: HeeJo Chi , NamJu Cho , Taewoo Lee
- Applicant Address: SG Singapore
- Assignee: Stats Chippac Ltd.
- Current Assignee: Stats Chippac Ltd.
- Current Assignee Address: SG Singapore
- Agency: Ishimaru & Associates LLP
- Main IPC: H01L23/06
- IPC: H01L23/06 ; H01L23/538 ; H01L21/56
Abstract:
A method of manufacture of an integrated circuit packaging system includes: mounting a device over an integrated circuit having a through via; attaching an interposer, having an opening, and the integrated circuit with the device within the opening; and forming an encapsulation at least partially covering the integrated circuit and the interposer facing the integrated circuit.
Public/Granted literature
- US20100237483A1 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH AN INTERPOSER AND METHOD OF MANUFACTURE THEREOF Public/Granted day:2010-09-23
Information query
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