Invention Grant
- Patent Title: Miniature electronic component for microwave applications
- Patent Title (中): 用于微波应用的微型电子元件
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Application No.: US11722306Application Date: 2005-12-07
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Publication No.: US08624373B2Publication Date: 2014-01-07
- Inventor: Marc Camiade , Pierre Quentin , Olivier Vaudescal
- Applicant: Marc Camiade , Pierre Quentin , Olivier Vaudescal
- Applicant Address: FR Orsay
- Assignee: United Monolithic Semiconductor S.A.
- Current Assignee: United Monolithic Semiconductor S.A.
- Current Assignee Address: FR Orsay
- Agency: Lowe Hauptman & Ham, LLP
- Priority: FR0413583 20041220
- International Application: PCT/EP2005/056584 WO 20051207
- International Announcement: WO2006/067046 WO 20060629
- Main IPC: H01L23/02
- IPC: H01L23/02

Abstract:
The invention relates to a miniature microwave component having: a microwave chip (18, 60, 140) encapsulated in an individual package (61) for surface mounting. A metal base (80) mounts the chip in the package via its rear face. The base has an aperture (82). At least two access ports are provided for the communication of electrical signals between the inside and the outside of the package. A contactless microwave access port (62), by electromagnetic coupling at the aperture in the base, ensures transmission of coupling signals at a working frequency F0. A subharmonic access port (110) via a contact, inputs, into the integrated circuit, a subharmonic frequency F0/n of the working frequency F0. The chip includes, among its electrical conductors, a coupling electrical conductor (96) connected to the electronic elements of the chip. The coupling conductor is placed at the contactless microwave access port (62) in order to transmit microwave signals by electromagnetic coupling at the working frequency F0.
Public/Granted literature
- US20100038775A1 MINIATURE ELECTRONIC COMPONENT FOR MICROWAVE APPLICATIONS Public/Granted day:2010-02-18
Information query
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