Invention Grant
- Patent Title: Package-on-package structure without through assembly vias
- Patent Title (中): 封装封装结构，无需通过组装通孔
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Application No.: US13649031Application Date: 2012-10-10
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Publication No.: US08624376B1Publication Date: 2014-01-07
- Inventor: Chih-Hua Chen , Chen-Shien Chen
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H03H7/38
- IPC: H03H7/38
Abstract:
A package-on-package (PoP) device including a top package and a bottom package including a first inductor and a second inductor on opposing sides of a wafer mold layer outside of a die area, the first inductor aligned with the second inductor to electrically couple the top package to a redistribution layer of the bottom package.
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