Invention Grant
- Patent Title: Circuit device and method of manufacturing the same
- Patent Title (中): 电路装置及其制造方法
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Application No.: US13189121Application Date: 2011-07-22
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Publication No.: US08624408B2Publication Date: 2014-01-07
- Inventor: Katsuyoshi Mino , Masaru Kanakubo , Akira Iwabuchi , Masami Motegi
- Applicant: Katsuyoshi Mino , Masaru Kanakubo , Akira Iwabuchi , Masami Motegi
- Applicant Address: BM Hamilton
- Assignee: ON Semiconductor Trading, Ltd.
- Current Assignee: ON Semiconductor Trading, Ltd.
- Current Assignee Address: BM Hamilton
- Agency: Morrison & Foerster LLP
- Priority: JP2010-164996 20100722
- Main IPC: H01L23/29
- IPC: H01L23/29
Abstract:
In a circuit device of the present invention, the lower surface side of a circuit board and part of side surfaces thereof are covered with a second resin encapsulant, and the upper surface side and the like of the circuit board are covered with a first resin encapsulant. Since heat dissipation to the outside of the circuit device is achieved mainly through the second resin encapsulant, a particle size of filler contained in the second resin encapsulant is made larger than a particle size of filler contained in the first resin encapsulant. Heat dissipation to the outside of the circuit device is greatly improved.
Public/Granted literature
- US20120018906A1 CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2012-01-26
Information query
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