Invention Grant
- Patent Title: Piezoelectric devices including electrode-less vibrating portions
- Patent Title (中): 压电器件包括无电极振动部分
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Application No.: US13052560Application Date: 2011-03-21
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Publication No.: US08624470B2Publication Date: 2014-01-07
- Inventor: Takehiro Takahashi
- Applicant: Takehiro Takahashi
- Applicant Address: JP Tokyo
- Assignee: Nihon Dempa Kogyo Co., Ltd.
- Current Assignee: Nihon Dempa Kogyo Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Klarquist Sparkman, LLP
- Priority: JP2010-069131 20100325
- Main IPC: H01L41/053
- IPC: H01L41/053

Abstract:
An exemplary piezoelectric device has a piezoelectric vibrating board including a portion that exhibits thickness-shear vibration, and a frame portion extending around and supporting the vibrating portion. A first cover board, bonded to the first main surface of the frame portion, has a first excitation electrode. A second cover board, bonded to the second main surface of the frame portion, has a second excitation electrode. Thus, the vibrating portion is sealed in a package formed by the frame portion and cover boards. A first convexity, defined either on the bonded main surface of the first cover board or on the first main surface of the frame portion, surrounds the excitation electrode and establishes a predetermined gap between the vibrating portion and excitation electrode. The first cover board and frame portion are bonded by adhesive applied, adjacent the first convexity but not on the first convexity, continuously around the vibrating portion.
Public/Granted literature
- US20110234054A1 PIEZOELECTRIC DEVICES INCLUDING ELECTRODE-LESS VIBRATING PORTIONS Public/Granted day:2011-09-29
Information query
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