Invention Grant
- Patent Title: Sensor assembly and methods of adjusting the operation of a sensor
- Patent Title (中): 传感器组件和调节传感器操作的方法
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Application No.: US12951633Application Date: 2010-11-22
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Publication No.: US08624603B2Publication Date: 2014-01-07
- Inventor: Yongjae Lee , Boris Leonid Sheikman , Steven Go
- Applicant: Yongjae Lee , Boris Leonid Sheikman , Steven Go
- Applicant Address: US NY Niskayuna
- Assignee: General Electric Company
- Current Assignee: General Electric Company
- Current Assignee Address: US NY Niskayuna
- Agent Jason K. Klindtworth
- Main IPC: G01R27/04
- IPC: G01R27/04
Abstract:
A microwave sensor probe includes a probe housing, an emitter body coupled to the probe housing, and an emitter coupled to the emitter body. The emitter is configured to generate an electromagnetic field from at least one microwave signal. At least one electromagnetic absorbent member is configured to absorb at least one of a current transmitted through the emitter and an electromagnetic radiation generated by the emitter.
Public/Granted literature
- US20120126827A1 Sensor Assembly And Methods Of Adjusting The Operation Of A Sensor Public/Granted day:2012-05-24
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