Invention Grant
- Patent Title: Test system and write wafer
- Patent Title (中): 测试系统和写晶圆
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Application No.: US12952110Application Date: 2010-11-22
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Publication No.: US08624620B2Publication Date: 2014-01-07
- Inventor: Yasuo Tokunaga , Yoshio Komoto
- Applicant: Yasuo Tokunaga , Yoshio Komoto
- Applicant Address: JP Tokyo
- Assignee: Advantest Corporation
- Current Assignee: Advantest Corporation
- Current Assignee Address: JP Tokyo
- Main IPC: G01R31/02
- IPC: G01R31/02

Abstract:
A test system for testing a plurality of semiconductor chips formed on a semiconductor wafer includes: a test wafer on which a plurality of test circuits corresponding to the plurality of semiconductor chips are formed, each test circuit testing a corresponding one of the plurality of semiconductor chips based on test data provided to the test circuit; where each of the plurality of test circuits includes a nonvolatile and rewritable pattern memory for storing the test data such as pattern data and sequence data, and the test system writes the same test data to all the plurality of test circuits in parallel.
Public/Granted literature
- US20110115519A1 TEST SYSTEM AND WRITE WAFER Public/Granted day:2011-05-19
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