Invention Grant
- Patent Title: Assembling magnetic component
- Patent Title (中): 组装磁性部件
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Application No.: US13164367Application Date: 2011-06-20
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Publication No.: US08624697B2Publication Date: 2014-01-07
- Inventor: Sywe-Rung Shang
- Applicant: Sywe-Rung Shang
- Applicant Address: TW Ta Wu Keelung
- Assignee: Curie Industrial Co., Ltd.
- Current Assignee: Curie Industrial Co., Ltd.
- Current Assignee Address: TW Ta Wu Keelung
- Agency: Jackson IPG PLLC
- Main IPC: H01F27/02
- IPC: H01F27/02 ; H01F17/06 ; H01F27/30 ; H01F27/24 ; H01F17/04

Abstract:
The main purpose of this invention is to improve high forming pressure of existing Fe—Si—Al insulating magnetic powder which is not suitable for forming, combine heterogeneous insulating magnetic powder, produce hollow cup-like cover and Fe—Si—Al rod core for full magnetic path component assembling, and change the shape structure of rod core and cover design, so there will be advantages including easy to winding, assemble and cooling.
Public/Granted literature
- US20120319812A1 Assembling magnetic component Public/Granted day:2012-12-20
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