Invention Grant
- Patent Title: Assembled circuit and electronic component
- Patent Title (中): 组装电路和电子元件
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Application No.: US13602326Application Date: 2012-09-04
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Publication No.: US08624701B2Publication Date: 2014-01-07
- Inventor: Jian-Hong Zeng , Wei Yang , Shou-Yu Hong , Jian-Ping Ying
- Applicant: Jian-Hong Zeng , Wei Yang , Shou-Yu Hong , Jian-Ping Ying
- Applicant Address: TW Taoyuan Hsien
- Assignee: Delta Electronics, Inc.
- Current Assignee: Delta Electronics, Inc.
- Current Assignee Address: TW Taoyuan Hsien
- Agency: Litron Patent & Trademark Office
- Agent Min-Lee Teng
- Priority: TW97100160A 20080103
- Main IPC: H01F5/00
- IPC: H01F5/00
Abstract:
An assembled circuit comprising a substrate, a coil, a first conductive segment, a second conductive segment, a first through-hole connector and a second through-hole connector is disclosed. The first conductive segment is electrically connected to one end of the first through-hole connector, the other end of the first through-hole connector is electrically connected to one end of the second through-hole connector via the first conductive segment, and the other end of the second through-hole connector is electrically connected to the second conductive segment.
Public/Granted literature
- US20120327625A1 ASSEMBLED CIRCUIT AND ELECTRONIC COMPONENT Public/Granted day:2012-12-27
Information query
