Invention Grant
- Patent Title: Methods of inspecting structures
- Patent Title (中): 检查结构的方法
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Application No.: US12662079Application Date: 2010-03-30
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Publication No.: US08625110B2Publication Date: 2014-01-07
- Inventor: Seouk-Hoon Woo , Jeong-Ho Yeo , Byeong-Ok Cho , Joo-On Park , Chang-Min Park , Won-Sun Kim
- Applicant: Seouk-Hoon Woo , Jeong-Ho Yeo , Byeong-Ok Cho , Joo-On Park , Chang-Min Park , Won-Sun Kim
- Applicant Address: KR Gyeonggi-Do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-Do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2009-0063547 20090713
- Main IPC: G01B11/28
- IPC: G01B11/28

Abstract:
A method of inspecting a structure. The method includes preparing preliminary spectrums of reference diffraction intensities according to critical dimensions of reference structures, obtaining a linear spectrum from the preliminary spectrums in a set critical dimension range, radiating light to respective measurement structures formed on a substrate, measuring measurement diffraction intensities of the light diffracted by the measurement structures, and obtaining respective critical dimensions of the measurement structures from the measurement diffraction intensities using the linear spectrum.
Public/Granted literature
- US20110007329A1 Methods of inspecting structures Public/Granted day:2011-01-13
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