Invention Grant
- Patent Title: Thickness measuring system for measuring a thickness of a plate-shaped member
- Patent Title (中): 用于测量板状构件的厚度的厚度测量系统
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Application No.: US13598630Application Date: 2012-08-30
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Publication No.: US08625112B2Publication Date: 2014-01-07
- Inventor: Xin Yang
- Applicant: Xin Yang
- Applicant Address: CN Shenzhen TW New Taipei
- Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen TW New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN201110400621 20111206
- Main IPC: G01B11/28
- IPC: G01B11/28

Abstract:
A thickness measuring system for measuring a thickness of a planar plate-shaped member on a conveyer belt includes a processor, a first distance measurer and a second distance measurer. The first distance measurer on one side of the conveyor belt can emit and receive a first light beam parallel to the conveyer belt for reflection off the planar plate-shaped member, and calculate a first distance between the first distance measurer and the plate-shaped member. The second distance measurer on the other side of the conveyor belt can emit and receive a second light beam and a third light beam for reflection off the planar plate-shaped member, and calculate a second distance between the first distance measurer and the plate-shaped member and a third distance between the second distance measurer and the plate-shaped member.
Public/Granted literature
- US20130141737A1 THICKNESS MEASURING SYSTEM FOR MEASURING A THICKNESS OF A PLATE-SHAPED MEMBER Public/Granted day:2013-06-06
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