Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US13011622Application Date: 2011-01-21
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Publication No.: US08625239B2Publication Date: 2014-01-07
- Inventor: Mototsugu Okushima
- Applicant: Mototsugu Okushima
- Applicant Address: JP Kanagawa
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Kanagawa
- Agency: Young & Thompson
- Priority: JP2010-014394 20100126
- Main IPC: H02H9/04
- IPC: H02H9/04

Abstract:
It is desired to effectively suppress breaking of a protection target circuit caused by direct application of an ESD surge voltage to the circuit. The semiconductor device includes: a VDD pad; a signal output pad; a GND pad; a high-potential power source line; a signal line; a low-potential power source line; main ESD protection elements; a PMOS transistor; and an output circuit. The output circuit includes: an NMOS transistor N1 whose source is connected to the signal line, and whose drain is connected to the low-potential power source line; and an NMOS transistor N2 connected between the gate of the NMOS transistor N1 and the low-potential power source line. The source of the PMOS transistor is connected to the signal line, the drain thereof is connected to the gate of the NMOS transistor N1, and the gate and back gate thereof are connected to the high-potential power source line.
Public/Granted literature
- US08587908B2 Semiconductor device Public/Granted day:2013-11-19
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